|
Your search returned 32 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
|
Year : 1993 Volume number : 16 Issue: 08 |
Evaluation Of A Three-Dimensional Memory Cube System
(Article)
Subject:
Evaluation
,
Three Cube
,
Memory
Author:
Claude L.
Bertin
David J.
Perlman
Stuart N.
Shanken
page:
1006
-
1011
A Study On Insertion Loss Improvement For An Optical Connector Using The Analysis Of Transmitted Optical Intensity
(Article)
Subject:
Study Of The Mixing
,
Optical
,
Optical Internet
Author:
Oh-Gone
Chun
Myung-Yung
Jeong
Tae-Goo
Choy
page:
768
-
777
Packaging And Reliability Of Photonic Components For Subscriber Network Systems
(Article)
Subject:
Packaging
,
Reliability
,
Network Synthesis
Author:
Junji
Yoshida
Masanori
Yamada
Hiroshi
Terui
page:
778
-
782
High Performance Optical Datalink Array Technology
(Article)
Subject:
High Performance
,
Optical
,
Array
Author:
Ronald A.
Nordin
D. Bruce
Buchholz
Nagesh R.
Basavanhally
page:
783
-
788
Directly Deposited Fluxless Lead Indium Gold Composite Solder
(Article)
Subject:
Lead -Free
,
Gold
,
Composite
Author:
Chen Y.
Wang
C H
Lee
Y M
Chen
page:
789
-
793
Creep Of Solder Interconnects Under Combined Loads
(Article)
Subject:
Author:
page:
794
-
798
Effect Of Post Reflow No Clean Solder Paste Residue On Electrical Performance
(Article)
Subject:
Author:
page:
799
-
801
Application Of Quality Function Deployment To The Design Of A Lithium Battery
(Article)
Subject:
Author:
page:
802
-
807
Fine Pitch Tab Assembly Technology For 820 Pin Count Ceramic Pga Using Single Point Bonding Technology At Room Temperature
(Article)
Subject:
Author:
page:
808
-
816
Fabrication Of Thin-Film Multilayer Substrate Using Copper Clad Polyimide Sheets
(Article)
Subject:
Author:
page:
817
-
821
Evaluation Of Tumblin Processes Of Multilayer Ceramic Capacitors For Surface Mount Device Applications
(Article)
Subject:
Author:
page:
822
-
827
An Overviw And Evaluation Of Anistropically Conductive Adhesive Films For Fine Pitch Electronic Assembly
(Article)
Subject:
Overview
,
Evaluation
,
Pitch Accent
,
Conductive Adhesive
Author:
David C
Chang
Graham B.
Mcbride
C. P.
Wong
page:
828
-
835
Accelerated Life Test Of Z-Axis Conductive Adhesives
(Article)
Subject:
Accelerated Life Test
,
Conductive Adhesive
Author:
D. D.
Chang
J. A.
Fulton
C. P.
Wong
page:
836
-
842
Electrical, Structural And Processing Properties Of Electrically Conductive Adhesives
(Article)
Subject:
Structural
,
Processing
,
Conductive Adhesive
Author:
Li Li.
Christine
Gabsoo
Kim
James E.
Morris
page:
843
-
851
A Fine Pitch Cog Technique For A Tft-Lcd Panel Using An Indium Alloy
(Article)
Subject:
Fine Aggregate
,
Panel
,
Indium
Author:
Miki
Mori
Yukio
Kizaki
Akinori
Hongu
page:
852
-
857
Encapsulants Used In Flip-Chip Packages
(Article)
Subject:
Encapsulant
,
Flip-Chip
,
Packaging
Author:
Darbha
Suryanarayana
Tien H.
Wu
Jack A.
Varcoe
page:
858
-
862
Encapsulant For Fatigue Life Enhancement Of Controlled-Collapse Chip Connection C4
(Article)
Subject:
Encapsulant
,
Enhancement
,
Controlled Atmosphere
Author:
David W.
Wang
Kostas I.
Papathomas
page:
863
-
867
Robust Titanate-Modified Encapsulants For High Voltage Potting Application Of Multichip Module Hybrid Ic
(Article)
Subject:
Author:
page:
868
-
875
Rigorous Electromagnetic Modeling Of Chip-To-Package First-Level Interconnections
(Article)
Subject:
Rigorous Dynamic Model
,
Modeling
,
Chip-To-Chip Interconnects
Author:
Y. G
Tsuei
Andreas C.
Cangellaris
John L.
Prince
page:
876
-
883
A Package Analysis Tool Based On A Method Of Moments Surface Formulation
(Article)
Subject:
Package Modeling
,
Tool Design
,
Surface
Author:
Saila
Ponnapalli
Robert
Bertin
Alina
Deutsch
page:
884
-
892
An 820 Pin Pga For Ultralarge-Scale Bicmos Devices
(Article)
Subject:
Pga
,
Ultralarge Scale Integration
,
Devices
Author:
Yoichi
Hiruta
Akihiko
Hirano
Toshio
Sudo
page:
893
-
901
Development Of A Cost-Effective High-Performance Metal Qfp Packaging System
(Article)
Subject:
Development
,
Cost-Effective
,
Metal Powder
Author:
Deepak
Mahulikar
Anthony
Pasqualoni
Jeffrey S.
Braden
page:
902
-
908
Investigation Of Plasma Effects On Plastic Packages Delamination And Cracking
(Article)
Subject:
Investigation
,
Plastic
,
Delamination
Author:
Frank
Djennas
Yushi
Matsuda
page:
919
-
918
Off-Axis Sensor Rosettes For Measurement Of The Piezoresistive Coefficients Of Silicon
(Article)
Subject:
Sensor
,
Measurement
,
Piezoresistance Coefficients
Author:
Richard C.
Jaeger
Malachy
Carey
R. Wayne
Johnson
page:
925
-
931
Effect Of Material Interactions During Thermal Shock Testing On Ic Package Reliability
(Article)
Subject:
Effect Of Material
,
During The Last Two Decades
,
Reliability
Author:
Luu T.
Nguyen
Andrea S.
Chen
Stephen A.
Gee
page:
932
-
939
Model And Analyses For Solder Reflow Cracking Phenomenon In Smt Plastic Packages
(Article)
Subject:
Model And Analysis
,
Smt
,
Package Modeling
Author:
Gams S.
Ganesan
Howard M.
Berg
page:
940
-
948
A Comprehensive Surfac Mount Reliability Model Covering Several Generations Of Packaging And Assembly Tecenology
(Article)
Subject:
Assembly Election
,
Comprehensive Design
,
Covering Ratio
Author:
Jean-Paul
Clech
John C.
Manock
page:
949
-
960
Attachment Reliability Evaluation And Failure Analysis Of Thin Small Outline Packages (Tsop'S) With Alloy 42 Leadframes
(Article)
Subject:
Attachment
,
Failure Analysis
,
Leadframes
Author:
Donna M.
Noctor
Franl E.
Bader
Richard
Foehringer
page:
961
-
971
Anisotropically Conductive Polymer Films With A Uniform Dispersion Of Particles
(Article)
Subject:
Anisotropic
,
Polymer Filtration
,
Uniform Approximation
Author:
Sungho
Jin
Thomas H.
Tiefel
Donald W.
Dahringer
page:
972
-
977
Interactive Thermal Modeling Of Electronic Circuit Boards
(Article)
Subject:
Interacting
,
Modeling
,
Electronic - Circuits
Author:
William .
Godfrey
Kaveh A.
Tagavi
M. Pinar
Menguc
page:
978
-
985
Correlation Of Analytical And Experimental Approaches To Determine Thermally Induced Pwb Warpage
(Article)
Subject:
Correlation
,
Experimental
,
Determine Layer
Author:
Chun-Ping
Yeh
C. A
Fulton
John W.
Stafford
page:
986
-
995
Physical Design Alternatives For Risc Workstation Packaging
(Article)
Subject:
Physical Design
,
Alternative Index
,
Packaging
Author:
D. E.
O'Brien
J. Peter
Krusius
B. M.
Hahne
page:
996
-
1005
|
|
| | |